Hui ploughed circuit board for 18 years, with profound technology accumulation, advanced product design capabilities, and a number of well-known customers to establish long-term cooperation. At the same time, the company continues to carry out product innovation, extending upstream to the industry, focusing on the field of higher technical barriers, has obtained 22 utility model patents, and continues to increase investment in technology research and development to ensure a leading edge.
Multi-layer Circuit
Minimum aperture: 0.15mm
Aspect ratio: 7:1
Plug hole diameter: 0.3MM-0.4MM
Blind hole: L1-L4
Line width / spacing: 4mil/4mil
Surface treatment: OSP
Thickness of OSP: 0.2-0.3mil
Multi-layer Circuit
Board thickness: 1.2MM
Minimum aperture: 0.15MM
Aspect ratio: 8:1 core
Board thickness: 0.1MM (without copper)
Plate type: FR-4
Line width: 3mil/3mil
The minimum green oil bridg