Hui ploughed circuit board for 18 years, with profound technology accumulation, advanced product design capabilities, and a number of well-known customers to establish long-term cooperation. At the same time, the company continues to carry out product innovation, extending upstream to the industry, focusing on the field of higher technical barriers, has obtained 22 utility model patents, and continues to increase investment in technology research and development to ensure a leading edge.
Multi-layer Circuit
Minimum aperture: 0.15mm
Aspect ratio: 7:1
Plug hole diameter: 0.3MM-0.4MM
Blind hole: L1-L4
Line width / spacing: 4mil/4mil
Surface treatment: OSP
Thickness of OSP: 0.2-0.3mil
Multi-layer Circuit
Board thickness: 1.2MM
Minimum aperture: 0.15MM
Aspect ratio: 8:1 core
Board thickness: 0.1MM (without copper)
Plate type: FR-4
Line width: 3mil/3mil
The minimum green oil bridg
Multi-layer Circuit
Number of floors: 4
Surface treatment: spray tin
Material: FR-4
Board Features: Taper Holes
Multi-layer Circuit
Board thickness: 1.6MM
Minimum aperture: 0.15MM
Aspect ratio: 10:1 sheet
Type: FR-4 KB-6167(Tg170)
Minimum line width/line spacing: 3.0mil/3.0mil
Double-layer
Board thickness: 1.6MM
Minimum aperture: 0.3MM
Aspect ratio 1:8
Surface ink: black oil
Minimum BGA diameter: 10mil (0.25mm)